HDI stands for High-Density Interconnector. A circuit board that has a higher wiring density per unit area as opposed to a conventional board called HDI PCB. HDI pcbs have good areas and lines, small vias and take-off pads, and high integration pad density. It helps in improving energy efficiency and reducing the weight and size of vessels. HDI PCB is the best choice for high-layer reading and expensive laminated boards.
For the electrical requirements of the speed signal, the board must have different types i.e. High-frequency transmission capability, impedance control, reduced excessive radiation, etc. The board should be elevated in volume due to miniaturization and arrays of electrical components. . On top of that, there is the result of leadless collection methods, good pitch package and direct chip bonding, the board is shown to have a special high-density.
Countless benefits associated with HDI PCB, such as high speed, small size and high frequency. It is the first component of portable computers, personal computers, and mobile phones. Currently, HDI PCB is widely used in other end user devices such as MP3 players and game consoles, among others.
CAMTECH PCB HDI takes advantage of current technologies to enhance the performance of circuit boards through parallel or less space. This rise in board technology is encouraged by the small size and semiconductor packages that support high quality in new products such as the touch screen tab.
HDI pcbs are characterized by high-density filters that include laser micro-vias, high performance to thin objects and fine lines. The better density allows more functions on one unit area. These types of multi-dimensional formats provide the necessary solution for large pin-counting chips that are used in mobile phones and other high-tech devices.
The placement of the parts on the circuit board requires more precision than the design of the storage board due to the small pads and good height of the circuit board. Leadless chips require special marketing techniques and other steps in assembly and processing processes. The low weight and HDI size of the circuit means that the pcbs are smaller in size and weigh less than the storage PCB system. The low weight and size even indicate that there is a small chance of injury from mechanical shock
HDI Printed Circuit Board Development
HDI printed circuit boards are made from the desire to provide an extra level of computing power and performance in a small envelope. This demand was driven largely by industries such as the telephone, which pushed to provide smaller and more powerful phones that needed to find a way to install more denser, denser packages. Thus, some of the key drivers in the development of the HDI PCB were the flow of Integrated Circuit (IC) technology that served as a compulsion to re-evaluate how printed circuit boards and assemblies were made. Some of these important IC technology systems include:
Decrease in gate size
Reduction of active voltage levels to control power dissipation
Higher levels of gate connection (i.e. More transistors per unit section than dies)
Quick signal departure time (high operating frequency and clocks)
The process of arranging the ICs also stems from the use of low-rotation leading frame packs directly to the top of the technology, allowing the placement of the connector pins under the entire IC surface.
One such technology is the Ball Grid Array (BGA), which places pins connecting the lead pattern below the IC. As more pins are added to the IC packages, the pin compatibility increases, and the dimensional space of the circuit board or pads decreases (known as pitch). While this helps with the goal of reducing the size of the electrical package, it also adds problems and requires a change in the manufacturing process of hdi pcb.
Bgas have other advantages, such as lower thermal protection between the device and the PCB. This fact helps to maintain an acceptable operating temperature for the chips becoming increasingly hard according to the transistor density. Another advantage of the grid array array is that the integration lead is shorter. Shorter leads reduce inductance in guides, which reduces signal distortion in high-speed circuits, improving overall performance.
HDI Technology Metrics
HDI printed circuit boards are measured using a number of technology metrics that focus on the integration and complexity of the device. These metrics indicate three areas:
- Assembly difficult
- Integrated circuit packaging
- Printed circuit board density
HDI PCB Terminology
The ability of HDI printed circuit boards to organize more electronic footprint depends on the use of new integration techniques such as micro vias and vias in the pad.
For printed circuit boards, the word via means the navigation systems that are printed on the board and serve as a link between different layers of multiple circuit breakers. As electronics grow in complexity, circuit boards have added pieces in order to provide an answer to the problem of how to connect different objects in a circuit without compromising other connections. Vias was the way in which circuit components could be integrated into these different components, a type of straightforward simulation within PCB.
There are several different types of vias used for HDI PCB manufacturing. These include:
- Through a hole
- Bofu vias
- Buried vias
- Micro vias